Электронная книга: Peter Ramm «Handbook of Wafer Bonding»

Handbook of Wafer Bonding

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Издательство: "John Wiley&Sons Limited"

ISBN: 9783527644247

электронная книга

Купить за 16756.14 руб и скачать на Litres

Другие книги автора:

КнигаОписаниеГодЦенаТип книги
Handbook of 3D Integration, Volume 3. 3D Process TechnologyEdited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As… — John Wiley&Sons Limited, электронная книга Подробнее...13126.82электронная книга

Look at other dictionaries:

  • Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) …   Wikipedia

  • Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

  • Корпусирование ИС — Ранняя советская микросхема К1ЖГ453 Корпусирование интегральных схем  завершающая стадия микроэлектронного производства, в процессе которой полупроводниковый кристалл устанавливается в корпус. Обычно состоит из этапов прикрепления крис …   Википедия

  • Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… …   Wikipedia

  • integrated circuit — Electronics. a circuit of transistors, resistors, and capacitors constructed on a single semiconductor wafer or chip, in which the components are interconnected to perform a given function. Abbr.: IC Also called microcircuit. [1955 60] * * * ▪… …   Universalium

  • Silicon — Not to be confused with the silicon containing synthetic polymer silicone. aluminium ← silicon → phosphorus C ↑ Si ↓ Ge …   Wikipedia

  • building construction — Techniques and industry involved in the assembly and erection of structures. Early humans built primarily for shelter, using simple methods. Building materials came from the land, and fabrication was dictated by the limits of the materials and… …   Universalium

  • Oxygen — This article is about the chemical element and its most stable form, O2 or dioxygen. For other forms of this element, see Allotropes of oxygen. For other uses, see Oxygen (disambiguation). nitrogen ← oxygen → fluorine ↑ O ↓ …   Wikipedia

  • Notary public — An embossed foil Notary Seal from the State of New York. A notary public (or notary or public notary) in the common law world is a public officer constituted by law to serve the public in non contentious matters usually concerned with estates,… …   Wikipedia

  • Zinc oxide — Other names Zinc white Calamine Identifiers …   Wikipedia

  • nanotechnology — /nan euh tek nol euh jee, nay neuh /, n. any technology on the scale of nanometers. [1987] * * * Manipulation of atoms, molecules, and materials to form structures on the scale of nanometres (billionths of a metre). These nanostructures typically …   Universalium