Электронная книга: Peter Ramm «Handbook of 3D Integration, Volume 3. 3D Process Technology»
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Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers. Издательство: "John Wiley&Sons Limited"
ISBN: 9783527670130 электронная книга Купить за 13126.82 руб и скачать на Litres |
Другие книги автора:
| Книга | Описание | Год | Цена | Тип книги |
|---|---|---|---|---|
| Handbook of Wafer Bonding | The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems… — John Wiley&Sons Limited, электронная книга Подробнее... | электронная книга |
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