Книга: Ramm Peter «Handbook of Wafer Bonding»
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Серия: "-" Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. To begin with, a thorough introductory section acquaints readers with the fundamentals of wafer bonding and the challenges facing this key technology. In the second part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The third and final part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices. Издательство: "Wiley" (2012)
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| Автор | Книга | Описание | Год | Цена | Тип книги |
|---|---|---|---|---|---|
| Peter Ramm | Handbook of Wafer Bonding | The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems… — John Wiley&Sons Limited, электронная книга Подробнее... | 16756.14 | электронная книга |
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