Книга: Ramani Mayappan «Intermetallic Study between Sn-Ag-Cu-Zn Solders and Copper Substrate»
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Производитель: "LAP Lambert Academic Publishing" Practically all microelectronics assemblies in use utilize Sn-Pb eutectic solder for interconnections. Owing to worldwide environmental legislation to ban toxic materials in solder and demands for green products, a variety of lead-free solders have been developed. Sn-Ag-Cu solder is one of the most suitable candidates to replace lead solders. However, the performance of Sn-Ag-Cu alloys is not considered good enough to meet all needs to be for a solder material. To improve the solder material properties, a fourth element, Zn, is added into the solder alloy. This book describes some properties of Sn-3. 5Ag-1. 0Cu-xZn reacting with copper substrate. The percentage of zinc varies between 0% and 0. 7%. The solders and copper substrate were let to react at different soldering time and temperature. Some information are given on the wetting behavior, the interfacial reaction morphology and intermetallic thickness as the soldering condition varies. The wetting reaction between the solders and... ISBN:9783845470016 Издательство: "LAP Lambert Academic Publishing" (2011)
ISBN: 9783845470016 |
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materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… … Universalium
